Atmospheric pressure plasma for process improvement in wire bonding
Atmospheric pressure plasma is used to improve the wire bonding process and leads to significant improvements in ball and wedge bonding.
Semiconductor technology and plasma? Cold atmospheric pressure plasma is used in many semiconductor manufacturing processes. A semiconductor is a solid material with electric properties in between those of conductors and insulators. The goal of plasma treatment is the finecleaning of semiconductor components and plasma activation, which leads to an increase in surface energy.
Key Word Search