relyon plasma @ Bondexpo
The 13th Bondexpo – International Trade Fair for Bonding Technology – will open its doors in Stuttgart from 7 to 10 October 2019. We are very pleased that relyon plasma is represented at Bondexpo 2019 with its own booth. Bondexpo convinces with a clear and consistent focus on the process chain of joining/bonding by means of gluing,
The Motek will take place in parallel at the Stuttgart Exhibition Centre. Motek is the world’s leading event in the fields of production and assembly automation, feed technology and material flow, streamlining through handling technology, and industrial handling. As such, Motek is the only trade fair to clearly focus on all aspects of mechanical engineering and automation and on the presentation of entire process chains.
Hall plan Bondexpo
Experience our innovative technology and relyon plasma at Bondexpo in Hall 6, booth 6437. Unique
Visit us at booth 6437
Visit us at Bondexpo and get a free entrance ticket for the exhibition!