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relyon plasma @ Bondexpo

relyon plasma @ Bondexpo

relyon plasma at Bondexpo 2019

The 13th Bondexpo – International Trade Fair for Bonding Technology – will open its doors in Stuttgart from 7 to 10 October 2019. We are very pleased that relyon plasma is represented at Bondexpo 2019 with its own booth. Bondexpo convinces with a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming. In addition, visitors will gain an in-depth insight into the current and future challenges in joining and bonding the broadest range of materials.

The Motek will take place in parallel at the Stuttgart Exhibition Centre. Motek is the world’s leading event in the fields of production and assembly automation, feed technology and material flow, streamlining through handling technology, and industrial handling. As such, Motek is the only trade fair to clearly focus on all aspects of mechanical engineering and automation and on the presentation of entire process chains.

Hall plan Bondexpo

Hallenplan Bondexpo – Internationale Fachmesse für Klebetechnologie

Experience our innovative technology and relyon plasma at Bondexpo in Hall 6, booth 6437. Unique are our plasma handheld devices like the piezobrush PZ2 or our plasmatool. We will also show you our all-in-one plasma system the plasmacell P300 in Stuttgart. You can try out our plasma systems directly on-site with your own materials and case studies.

Visit us at booth 6437

Visit us at Bondexpo and get a free entrance ticket for the exhibition!

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How did you hear about us? Online researchSocial mediaProfessional journalExhibition / EventReferral