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Training in adhesive technology

with John P. Kummer – Semiconductor Technology

Our partner, John P. Kummer GmbH, gives an insight into the variety of applications and basics of adhesive technology in the one-day training course on bonding technology. Dr. Dariusz Korzec from relyon plasma will give insights into surface analysis and surface pretreatment with plasma.

Gluing – Applying – Understanding

How do we read and understand the information in the technical data sheet? Bonding is not an isolated process but belongs to the special processes according to ISO 9001:XX. This special process is described in DIN 2304-1 and detailed in DIN SPEC 2305-1. So what must be done to achieve the properties mentioned in the data sheet?

Starting with the adhesive preparation, we will observe each individual process step, analyze the surface quality with the contact angle measuring device VCA Optima XE of the manufacturer AST Products Inc., clean the parts to be joined using plasma technology and show you how far the dosing technology can be successfully carried out as a final process step, errors avoided and the adhesive successfully used in the individual application.

John P. Kummer Logo

Event location:
John P. Kummer GmbH
Conference room on the ground floor
Steinerne Furt 78, 86167 Augsburg

Event dates:
22.10. – 23.10.2019

Event costs:
495,- € plus VAT.
incl. catering during the training course, dinner, consumables, dosing needle assortment, training documents and
certificate of participation

Program training adhesive technology

Tuesday 22.10.2019
until 01.00 pm: Own journey, we welcome you with a small snack
01.00 – 05.00 pm: Basics of adhesive technology and adhesive selection
07.00 pm: Get-together at Gasthof zur Linde

Mittwoch 23.10.2019
08.30 – 12.00 pm: Surface analysis and surface pretreatment
01.00 – 04.30 pm: Dosing 4.0 (including practical demonstration / application in the laboratory)

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