Adhesion issues in production
The problem: Adhesion issues typically appear only during production – when it’s already too late.
If bonding or coating processes fail, adjustments are usually made to materials or adhesives.
However, the root cause is often something invisible: the surface.
Materials with low surface energy or microscopic contamination can lead to unstable adhesion processes – resulting in rework and customer complaints.
The solution: targeted surface activation with plasma
Atmospheric plasma enables fast, reproducible surface activation without chemicals.
This leads to significantly improved adhesion and process stability.
- Improved adhesion for bonding, coating and printing
- Reduced rework
- Stable and scalable processes
How our solution is used
Get inspired by typical use cases and customer success stories:
– Cleaning of metals e.g. cylinder heads
– Structural bonding of CFRP
– Pretreatment of plastics
– Cable assembly for control elements
– Surface pre-treatment e.g. for QR code printing
– Preparation of glass for digital printing
– Optimized labeling printing on pipes and cables
– Bonding of individual parts in the SLS process
– Integration into Aerosol Jet Printing System
– Adhesion improvement in the fused filament fabrication (fff-fdm) process
– Modification of surfaces
– Fine cleaning of silicon chips before bonding
– Assistance technology for novel wafer splitting processes
– Improvement of adhesion between different materials
– Production of composite film for food packages
– Preparation before printing foils
– Cable assembly
– Activation of wires
– Treatment of electrical boards before potting
What´s your next step
Whether you need expert guidance or a ready-to-use unit, choose how you’d like to move forward.
Consulting
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Rental unit
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